YIHUA 850 SMD BGA Hot Air Rework Station + Diaphragm Pump Max. 24L/min


Applicable to desoldering of several types of elements: SOIC, CHIP, QFP, PLCC, BGA; the smaller the gun nozzle, the stronger of the force; suitable for desoldering of single soldering spots.

 YH-850 Diaphragm pump hot air desoldering station

Product Features

1.Fine-control diaphragm pump is employed for powerful airflows; the smaller the nozzle of the gun, the stronger the airflow.

(a) Nozzles with diameters smaller than 5 mm and normal-sized nozzle (8 mm, 10 mm, 12mm) are suitable for use, we do not recommend use with larger nozzles. Since the pressure of the air pump is large, the smaller the nozzle the stronger the force, and even small nozzles are able to blow out the hot air from the handle.

(b) Characteristics of the diaphragm pump type airflow: large pressure and small volume (the maximum volume is 24 or 28 L/min)

(c) Applicable range:

The smaller the gun nozzle installed in the machine, the bigger the pressure and stronger the force, suitable for desoldering of single small soldering spots.

2.a cutting-edge ceramic-framed heating core for extremely stable and reliable performance!

3.The air gun handle wire employs a high-temperature silicone wire (undamaged when 300o soldering tip contacts silicone wire for 30 seconds)




Product parameters

Performance Parameters of the Machine
Rated VoltageAC 220V±10%  50Hz
Total Power550W
working condition0~40℃  relative humidity <80%
Operating Environment-20~80℃ relative humidity <80%
Temperature Range100℃~450℃
air supply modePump air supply
Air Flow24L/min(Max)
Temperature stability±15℃ (static state)
Heating elementCeramic skeleton heater


standard configuration

Desoldering station    1               Manual :      1

Air gun handle    1                   Nozzle:3(5mm  8mm 10mm)

IC extractor     1                    Holder   1

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